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UHP Standard

ZHGC-101-01 In-line High Pressure Gas Particle Counter

In-line high-pressure particle counter engineered for wafer fab front-end gas delivery systems. Features a proprietary passive laser cavity achieving 0.1 μm @ 0.1 cfm sensitivity at 40–150 psig. Compatible with N2, Ar, He, and other UHP inert gases. NIST-traceable calibration.

ZHGC-101-01 In-line High Pressure Gas Particle Counter

Core Advantages

Cost-Effectiveness

  • Provides real-time 0.1μm in-line data, reducing traditional off-line sampling qualification cycles for gas delivery systems from over 14 days to under 3 days, cutting certification costs by 70%.
  • In-situ monitoring at full 40-150 psig process pressure eliminates wafer scrap caused by nano-scale particle contamination, directly recovering massive yield losses.
  • Seamlessly compatible with CDA, N2, Ar, He, and other semiconductor inert gases, eliminating the need for dedicated equipment per gas line and significantly reducing CapEx.

Process Control Improvement

  • Continuously verifies UHP gas purity in-situ, ensuring process gases strictly meet or exceed ISO Class 1 standards before reaching the wafer chamber.
  • Features an ultra-low zero count level of < 0.2 particles/min, enabling sub-second detection and early warning of even the slightest anomalies in the gas line.
  • Provides high-resolution particle size distribution data across 8 independent channels (0.1μm to 5.0μm), helping engineers quantitatively evaluate the true impact of valve replacements or system modifications.
  • Seamlessly integrates with facility MES/SCADA systems via Modbus TCP / RS-485, enabling comprehensive data storage, instant alerts, and fully compliant Audit Trails.

Applications

Gas System Qualification

Pain Point: New or post-maintenance gas delivery systems have long pipe runs and numerous nodes. Traditional off-line sampling easily misses contamination, resulting in qualification cycles exceeding 14 days and delaying fab startup.

Solution: Provides in-situ, NIST-traceable monitoring data, slashing the entire gas distribution system qualification cycle from over 14 days to under 3 days.

Process Gas Monitoring

Pain Point: In advanced 3nm/2nm nodes, nano-scale particles entrained in process gases directly cause wafer crystal defects. A single undetected contamination event can result in millions of dollars in direct yield loss.

Solution: Delivers real-time 0.1μm particle alarms at full pipeline pressure (40-150 psig), instantly intercepting contaminated gas before it reaches the wafer chamber to prevent batch scrapping.

Reactive Gas Monitoring

Pain Point: Traditional active-cavity sensors are easily eroded when monitoring highly corrosive or reactive specialty gases, posing severe gas leak safety risks and incurring prohibitively high replacement costs.

Solution: Utilizes a proprietary passive laser cavity and fully passivated 316L stainless steel wetted surfaces to ensure safe, long-term monitoring of hazardous reactive gases, reducing maintenance frequency by over 60%.

Technical Specifications

Technical Specifications

Size Channels8 Channels (0.1, 0.2, 0.3, 0.5, 1.0, 2.0, 3.0, 5.0μm)
Flow Rate0.1 scfm
Sampling Tube316L EP Tube
Counting Efficiency>50% @ 0.14μm
Zero Count Level< 2 counts/ft³ or 0.2 counts/min
Max Concentration3,000 counts/ft³
Laser TypeHe-Ne Laser
Sampling Interval0.5 sec to 24:00:00
Test MethodMie Scattering Method
Compatible GasesCDA, N2, Ar, He, etc.
Sample Time6 sec - 99 min 59 sec (per sample)
Interval Time6 sec - 99 min 59 sec (cycle)
Location LabelsUp to 99 locations
Data DisplayCumulative (Σ), Differential (Δ), Bar & Line Graphs
Storage Capacity256MB or larger optional
CalibrationNIST Traceable
Display8" Color LCD Touchscreen, Industrial G+G Structure, Chemically Tempered Glass (Hardness ≥6H), Transmittance ≥85%
Touch SpecsPCAP (Projected Capacitive), 5/10-point Multi-touch, Response <10ms, Lifespan ≥50M Touches

Physical & Electrical Specs

Dimensions650mm * 200mm * 230mm
Weight28kg
Data Interface10/100M Ethernet, RS-485, Optional Wi-Fi Module
Power Supply100-240V, 50-60Hz, 1A
Environmental RequirementsTemperature: 32-113°F (0-45°C). Humidity: Non-condensing. Max Altitude: 3000m
Display Power24V DC
Video InterfaceHDMI / VGA / LVDS
Display Power ConsumptionTouch panel < 1W; Total < 20W
Display Environmental RequirementsOperating Temp: -20℃ to 70℃ / Storage Temp: -30℃ to 80℃
Power24V DC ± 10%, < 5W (Adapter Included)
CommunicationRS-485 (Modbus RTU), Modbus TCP (Ethernet)
Analog Output4-20mA (2 Channels, Configurable)
Alarm OutputDry Contact Relay
Status IndicatorsMulti-color LED (Power, Flow, Status, Alarm)

Frequently Asked Questions / FAQ

Why is 0.1μm-level particle detection in specialty gases critical for advanced semiconductor processes?

In advanced nodes (such as 5nm/3nm), environmental cleanliness requirements are extremely stringent. Any microscopic particle larger than one-tenth of the process node (e.g., 0.1μm) that deposits on the wafer surface via process gases (like CDA, N2, or Ar) can trigger fatal photolithography defects, short circuits, or open circuits, leading to millions of dollars in wafer scrap. Because particle contamination is directly linked to yield rates, adopting real-time high-pressure in-line particle monitoring (rather than traditional 14-day offline sampling) has become an indispensable step for semiconductor fabs to safeguard their baseline yield and mitigate process risks.

Get in Touch

Contact Sales

Interested in the ZHGC series or full-stack gas detection solutions? Let us know your requirements.

Email

sales@zolixtech.com

Headquarters

Room 1425, 14F, Chuangxinghui Finance Building, No. 777 Guanggu 3rd Rd, Wuhan, Hubei